New method to measure thermal shock resistance in ceramics using a piezo-spectroscopic technique

A new method for assessing the critical temperature in thermally shocked ceramics is proposed. It is based on the measurement of stress relaxation of residual stresses as a consequence of thermal shock. The change in the stress-field is determined by piezo-spectroscopic technique. The technique is described and the results analyzed. The values obtained are compared with those obtained by the conventional method based on strength degradation measured on test pieces quenched at different temperatures. The agreement among the data is very good.