This paper presents the design and reliability assessments of a novel power semiconductor module platform for the automotive powertrain. Solder-free interconnects enable superior reliability meeting future automotive requirements. Modules with heavy Cu wire bonding on sintered top plates show a strongly improved power cycling lifetime compared to standard Al wire bonding. However, new failure modes are observed for the fully sintered devices.

Power module platform for automotive reliability requirements

Salvatore Giovanni;
2019-01-01

Abstract

This paper presents the design and reliability assessments of a novel power semiconductor module platform for the automotive powertrain. Solder-free interconnects enable superior reliability meeting future automotive requirements. Modules with heavy Cu wire bonding on sintered top plates show a strongly improved power cycling lifetime compared to standard Al wire bonding. However, new failure modes are observed for the fully sintered devices.
21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/10278/5009063
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